Technology: | Flex, Rigid-Flex and Printed Circuit Board |
Quick Turnaround: | FLEX 2 - 3 Business Days (Standard Complexity) Rigid Flex 3 - 5 Business Days (Standard Complexity) Printed Circuit Board 3 - 5 Business Days (Standard Complexity) |
Layer | I - 34 |
Via Interconnect | Blind and Buried Via |
Finishes: | SMOBC, HASL LEADFREE, Hard, Soft, Immersion Gold, Silver Immersion, Palladium, and OSP |
SMT: | 8 Mil Pitch |
Material Rigid: | GF FR 4, GI Polyimide, Getek, and Rogers |
Material Flex: | Dupont, Pyralux, Roger FR |
Etchback: | Plasma |
Impedence: | +/- 5% and 10% |
Solder Mask: | Liquid Photo Imageable |
Inspection: | Automatic Optical Inspection |
Electrical Test: | Flying Probe, Top & Bottom Fixtures, Net List |
Fabrication: | V-Score, Mil-down, Counter sink and bore, Edge-bevel gold connectors. |
Panel Size: | 18 x 24, 12 x 18 |
Max. Board Size: | 16 x 22 |
Design and Layout: | Please provide us your Schematic Diagram, Bill of Material Fabrication notes. |
Component Assembly: | Please provide us your Gerber Data, Bill of Materials, and Assembly Notes. |